Product overview
- Product number
- 833900T00000
- Manufacturer
- Comair Rotron
- Catalog
- Thermal - Heat Sinks
- product description
- HEATSINK STAMP 25.9X15X9.5MM
Documents and media
- Datasheets
- 833900T00000
Product Details
- Attachment Method :
- SMD Pad
- Diameter :
- -
- Material :
- Copper
- Material Finish :
- Tin
- Package Cooled :
- TO-263 (D²Pak)
- Part Status :
- Obsolete
- Power Dissipation @ Temperature Rise :
- 2.0W @ 40°C
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 5.00°C/W @ 400 LFM
- Thermal Resistance @ Natural :
- -
- Type :
- Board Level
product description
HEATSINK STAMP 25.9X15X9.5MM
Purchases and prices
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