Product overview
- Product number
- HSS-C2591-SMT-TR
- Manufacturer
- CUI Devices
- Catalog
- Thermal - Heat Sinks
- product description
- HEAT SINK TO-263 COPPER
Documents and media
- Datasheets
- HSS-C2591-SMT-TR
Product Details
- Attachment Method :
- -
- Diameter :
- -
- Material :
- Copper
- Material Finish :
- Tin
- Package Cooled :
- TO-263 (D²Pak)
- Part Status :
- Active
- Power Dissipation @ Temperature Rise :
- 2.1W @ 75°C
- Shape :
- Rectangular, Fins
- Thermal Resistance @ Forced Air Flow :
- 8.15°C/W @ 200 LFM
- Thermal Resistance @ Natural :
- 35.71°C/W
- Type :
- Top Mount
product description
HEAT SINK TO-263 COPPER
Purchases and prices
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