Product overview
- Product number
- SMD291SNL50T6
- Manufacturer
- Chip Quik, Inc.
- Catalog
- Solder
- product description
- SOLDER PASTE IN JAR 50G (T6) SAC
Documents and media
- Datasheets
- SMD291SNL50T6
Product Details
- Composition :
- Sn96.5Ag3Cu0.5 (96.5/3/0.5)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Jar, 1.76 oz (50g)
- Melting Point :
- 422 ~ 428°F (217 ~ 220°C)
- Mesh Type :
- 6
- Part Status :
- Active
- Process :
- Lead Free
- Shelf Life :
- 6 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 37°F ~ 46°F (3°C ~ 8°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
product description
SOLDER PASTE IN JAR 50G (T6) SAC
Purchases and prices
Recommended Products
You may be looking for
FTS-114-03-F-DV-A-P
MS24264R24B61PNL
CA01COM-PG28-11S-B-01
LCB1-10F-E
MS27656E25C1P
FTS-126-02-F-SV
MS3452LS20-15S
LCAF1-38-X
K11K0C-P08LFG0-4000
FTS-123-01-LM-D
FTS-110-04-FM-DV-A
MS3456KS18-8P
LCD2-14DH-Q
LCA8-38-M
CIR02R-20-2P-F80-T12
C48-16R16-10S7-102
MS3459LS18-1P
FTS-114-03-F-DV-S-P
D38999/20JC35PN
LCB1-10H-E
