- Part Status：
-
- Shape：
-
- Package Cooled：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Filter：
136 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
CUI Devices | HEATSINK TO-220 2.9W... |
2,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.1W... |
8,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
4,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.2W... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,350 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,350 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,200 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 4.8W... |
1 |
1
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 2.3W... |
3,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 3.6W... |
10,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
1,800 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 6.5W... |
6,000 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEATSINK TO-220 9.8W... |
5,400 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
2,500 |
3,000
In-stock
|
Get Quote | ||
|
|
CUI Devices | HEAT SINK, EXTRUS... |
2,500 |
3,000
In-stock
|
Get Quote |
